
Incorporated in 1993, Cyient DLM Limited provides Electronic Manufacturing Services (EMS) and solutions.
The company provides Electronic Manufacturing Services as Build to Print ("B2P") and Build to Specification ("B2S") services. B2P solutions involve clients providing the design for the product for which the company provides agile and flexible manufacturing services. And, B2S services involve designing the relevant product based on the specifications provided by the client and manufacturing the product.
Cyient DLM's solutions primarily comprise:
Printed circuit board ("PCB") assembly ("PCBA"),
Cable harnesses, and
Box builds which are used in safety critical systems such as cockpits, inflight systems, landing systems, and medical diagnostic equipment.
The company's client list includes Honeywell International Inc. ("Honeywell"), Thales Global Services S.A.S ("Thales"), ABB Inc, Bharat Electronics Limited, and Molbio 152 Diagnostics Private Limited, and so on.
Cyient DLM IPO Details
Cyient DLM IPO is a Book Built Issue. The IPO total issue size is Rs 592.00 Cr. The Cyient DLM IPO price is ₹250 to ₹265 per share. The IPO will list on BSE, NSE.
Cyient DLM IPO Reservation
Cyient DLM IPO a total of 22,375,751 shares are offered. QIB: 6,532,076 (29.19%), RII: 2,177,358 (9.73%), NII: 3,266,037 (14.60%).
Cyient DLM IPO Anchor Investors Details
Cyient DLM IPO raises Rs 259.65 crore from anchor investors. Cyient DLM IPO Anchor bid date is Jun 26, 2023
Cyient DLM IPO Timetable (Tentative)
Cyient DLM IPO opens on Jun 27, 2023, and closes on Jun 30, 2023.
Cyient DLM IPO Lot Size
The minimum lot size of this Cyient DLM IPO is 56 shares required is ₹14,840.
Cyient DLM IPO Promoter Holding
Promoter of the company is Cyient Limited.
Company Financials
Key Performance Indicator
Cyient DLM IPO Market Cap is Rs 2101 Cr and P/E (x) is 66.25.
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